{"id":"tp-40833","type":"article-newspaper","title":"Samsung Electronics, SK hynix Aim for HBM4 Shipments Around Q2 2027","author":"John Kim","publisher":"TOKENPOST Inc.","url":"https://www.tokenpost.com/news/business/40833","datePublished":"2026-10-26T06:44:56.000Z","dateModified":"2026-10-26T06:44:56.000Z","language":"en","abstract":"The eight-layer memory is planned for NVIDIA’s Rubin Ultra NVL rack-scale systems; 12-layer HBM4 remains the main focus for 2026.","section":"Business","references":[]}