# GlobalFoundries Signs $2 Billion TSMC CoWoS Deal for New York Site

By John Kim

Canonical URL: https://www.tokenpost.com/news/business/43058
Published: 2026-10-28T23:22:25.000Z
Updated: 2026-10-28T23:22:25.000Z
Section: Business

> The five-year agreement covers silicon interposers, with production expected to begin ramping in Malta during the first half of 2028.

GlobalFoundries announced Oct. 8 a five-year, $2 billion agreement with Taiwan Semiconductor Manufacturing Co. (TSMC) to manufacture silicon interposers for TSMC’s CoWoS packaging technology at GlobalFoundries’ Malta site in New York.

Production is expected to begin ramping at the site in the first half of 2028. The agreement covers the interposer stage, one part of the broader packaging process.

CoWoS combines logic chips and high-bandwidth memory in a single package, providing AI accelerators with data bandwidth for computing workloads.