{"id":"tp-45276","type":"article-newspaper","title":"川湖科技 Plans NT$10 Billion Bond Sale for Factory Expansion","author":"John Kim","publisher":"TOKENPOST Inc.","url":"https://www.tokenpost.com/news/business/45276","datePublished":"2026-10-31T01:24:02.000Z","dateModified":"2026-10-31T01:24:02.000Z","language":"en","abstract":"The five-year, zero-coupon offerings would support a planned NT$10.5 billion share subscription in 川益科技 for its third and fifth factories.","section":"Business","references":[]}