# Taiwan Suppliers Prepare Plants and Chip IP for TSMC’s 2-Nanometer Ramp By John Kim Canonical URL: https://www.tokenpost.com/news/business/47616 Published: 2026-11-03T11:54:32.000Z Updated: 2026-11-03T11:54:32.000Z Section: Business > TSMC expects 2027 N2-family capacity to exceed its 2026 level by more than 100% as suppliers advance construction, equipment and chip-design projects. Taiwanese suppliers are preparing new plant, equipment and chip-design work around Taiwan Semiconductor Manufacturing Co. (TSMC)’s 2-nanometer ramp, which the company expects to more than double in 2027. Production for TSMC’s N2 family began in late 2025 and is increasing at Hsinchu Baoshan and Kaohsiung. The company forecasts 2027 capacity to be more than 100% above the 2026 level. Its capital spending plan for 2026 remains $60 billion to $64 billion, while investment over 2026 through 2028 is expected to be significantly higher than in the prior three-year period. TSMC Chairman and CEO C.C. Wei has tied advanced-process expansion to demand from smartphones, high-performance computing and AI. The capacity outlook was covered in TokenPost’s earlier [N2 growth coverage](). 漢唐 and 帆宣 handle fab-construction work for customers in Taiwan and overseas. 漢唐 said major customers had begun investing in several fab projects, with construction demand rising and expected to continue. 帆宣’s order outlook runs at least into 2028, and the company has prepared staff and materials for customer construction schedules. 家登 is positioning itself in carrier markets for extreme ultraviolet (EUV) masks, wafers and advanced packaging. Its advanced-packaging carriers have a track record with panel-level packaging facilities and substrate makers. The company is preparing a new facility in Kurume, Japan. 弘塑 and 辛耘 are pursuing wet-process and cleaning-equipment orders. 辛耘 is building a second plant in 湖口 to add in-house capacity for wet-process tools and equipment for 2.5D and 3D advanced packaging. It is also constructing a Tainan facility to serve customers in southern Taiwan. In September, 創意 announced that it had completed the design of HBM4E physical-layer and controller intellectual property (IP) for TSMC’s N2P process and CoWoS-L packaging. The IP supports a data rate of 16 gigabits per second and has been adopted for an AI application-specific integrated circuit. 円星科技 also completed tape-out of its eUSB2V2 interface IP on TSMC’s N2P platform. 辛耘 plans to open its second 湖口 plant by year-end. 家登 expects construction at its Kurume facility to finish in 2027, with production to ramp in line with customer demand. ## Links in this article - [N2 growth coverage](https://www.tokenpost.com/news/business/34021)