# NVIDIA Adds JNTC to Supplier List as Paid Glass Samples Continue

By John Kim

Canonical URL: https://www.tokenpost.com/news/business/51232
Published: 2026-11-08T01:03:50.000Z
Updated: 2026-11-08T01:03:50.000Z
Section: Business

> The South Korean processor remains at the paid-sample stage, with initial production supply planned for mid-2028.

JNTC has begun supplying paid samples of through-glass-via (TGV) substrates to NVIDIA after joining the chipmaker’s procurement supplier list. The registration allows paid purchases after initial quality checks, but it is not a mass-production order. JNTC remains in the paid-sample phase.

JNTC first contacted NVIDIA in September 2026 and entered the supplier list about a month later. The samples include a 2 mm-thick TGV substrate that JNTC developed in June. Its process drills small holes in glass, then uses etching, metallization and chemical mechanical polishing.

The sample’s peel strength, which measures the bond between the glass and copper inside the vias, is about 0.8 kilogram-force per millimeter (kgf/mm). That is twice the stated industry requirement of 0.4 kgf/mm. The glass also showed no microcracks after copper was chemically removed following metallization. A weak bond can lead to cracks around the vias or cause glass to tear when the substrate is cut into individual units after build-up.

TGV evaluation generally starts with a small number of free samples for specification changes and basic reliability checks. Paid sample evaluations then use hundreds to thousands of units to assess whether quality and yield can remain stable at production scale. Substrate makers or outsourced semiconductor assembly and test (OSAT) providers can then build up the substrate, assemble chips and assess reliability.

JNTC is also working with Japanese company Toppan on TGV substrates for Broadcom. The company has signed nondisclosure agreements with about 30 substrate makers, semiconductor companies and OSAT providers; about 10 are evaluating paid samples.

Glass is being considered as a material for next-generation advanced packaging as artificial intelligence chips grow larger and more complex. JNTC plans to use its Hwaseong pilot line to meet customer sample demand. It plans to start building a production line in Gimcheon in the second half of 2027, with initial production supply targeted for mid-2028.