{"id":"tp-55256","type":"article-newspaper","title":"AMD Completes Panel-Level EFB Validation and Targets 2027 CPU Production","author":"John Kim","publisher":"TOKENPOST Inc.","url":"https://www.tokenpost.com/news/business/55256","datePublished":"2026-11-12T10:45:42.000Z","dateModified":"2026-11-12T10:45:42.000Z","language":"en","abstract":"Venice will use TSMC’s N2 process and CoWoS-L packaging, while SP8 is expected in the first half of 2027.","section":"Business","references":[{"title":"Venice panel-level packaging effort had a Q1 2027 initial volume-production target","url":"https://www.tokenpost.com/news/business/43340"}]}