{"id":"tp-55608","type":"article-newspaper","title":"Samsung Advances HBM Packaging Plant Opening by One Year","author":"John Kim","publisher":"TOKENPOST Inc.","url":"https://www.tokenpost.com/news/business/55608","datePublished":"2026-11-12T16:02:08.000Z","dateModified":"2026-11-12T16:02:08.000Z","language":"en","abstract":"The Asan line is scheduled to begin operating in June 2028 and will make HBM4E and other next-generation memory products.","section":"Business","references":[]}