{"id":"tp-29966","type":"article-newspaper","title":"Samsung Prepares HBM4E Cooling for Larger AI Interposers","author":"Simon Yoon","publisher":"TOKENPOST Inc.","url":"https://www.tokenpost.com/news/technology/29966","datePublished":"2026-10-12T01:00:01.000Z","dateModified":"2026-10-12T01:00:01.000Z","language":"en","abstract":"Interposers connecting processors with high-bandwidth memory could grow from 5.5 times the maximum EUV exposure area to roughly 40 times that size.","section":"Technology","references":[]}