# Samsung and AMD Demonstrate CXL Memory Pooling at OCP Summit

By Simon Yoon

Canonical URL: https://www.tokenpost.com/news/technology/31605
Published: 2026-10-14T07:02:43.000Z
Updated: 2026-10-14T07:02:43.000Z
Section: Technology

> The system uses Samsung’s CMM-D technology to let multiple systems share memory. Samsung also displayed HBM5, zHBM and newer storage technologies.

Samsung Electronics and AMD demonstrated a Compute Express Link (CXL) memory expansion system at OCP Global Summit 2026, showing how multiple systems can share memory and expand capacity for artificial intelligence workloads.

The demonstration used Samsung’s CMM-D memory-pooling technology. The companies did not disclose performance figures, customer names or a commercialization timeline.

Samsung also displayed HBM5, customized high-bandwidth memory, zHBM and processing-in-memory technology. Its storage lineup included QLC NAND and Flexible Data Placement (FDP) SSD technology, alongside demonstrations of key-value cache optimization and Direct Storage for AI systems.

Samsung and AMD signed a memorandum of understanding in March to expand their work on next-generation AI memory and computing technologies. The OCP demonstration showed their collaboration on a CXL system, but large-scale data center adoption remains to be validated.

High-bandwidth memory remains central to AI accelerators, while the CXL system demonstrated a way to expand memory capacity.