# Groq Weighs 3D-Stacked DRAM for Its Next-Generation AI Chip By Simon Yoon Canonical URL: https://www.tokenpost.com/news/technology/36608 Published: 2026-10-21T11:32:17.000Z Updated: 2026-10-21T11:32:17.000Z Section: Technology > If adopted, the design would prioritize memory capacity over the faster SRAM in Groq’s current chips. Groq is evaluating three-dimensional DRAM stacking for a future AI chip, an option that would prioritize memory capacity over the faster SRAM in its current design if adopted. The approach, known as 3DS, connects DRAM dies vertically through silicon vias. The stacked dies can function as one chip, reducing package area and improving power efficiency compared with a flat layout. Groq’s current design uses SRAM, which is faster than DRAM but holds less data. Both 3DS and high-bandwidth memory (HBM) use vertical connections, but HBM focuses on data-transfer speed. 3DS retains the existing DRAM interface and focuses on adding capacity. Groq was founded in 2016 by Jonathan Ross, a former Google TPU designer. In December 2025, Groq announced a [nonexclusive inference technology licensing deal with Nvidia]() and said it would remain independent and continue operating GroqCloud. ## Links in this article - [nonexclusive inference technology licensing deal with Nvidia](https://www.tokenpost.com/news/regulation/26798)