{"id":"tp-37938","type":"article-newspaper","title":"Nvidia Partners Plan to Raise Substrate Capacity 2.5-Fold","author":"Simon Yoon","publisher":"TOKENPOST Inc.","url":"https://www.tokenpost.com/news/technology/37938","datePublished":"2026-10-22T14:08:27.000Z","dateModified":"2026-10-22T14:08:27.000Z","language":"en","abstract":"Amkor’s CoWoS-R capacity is set to triple, while SPIL plans a substantial increase in co-packaged optics capacity.","section":"Technology","references":[]}