{"id":"tp-50034","type":"article-newspaper","title":"Intel Projects AI Chip Packages Could Reach 240 Millimeters Square","author":"Simon Yoon","publisher":"TOKENPOST Inc.","url":"https://www.tokenpost.com/news/technology/50034","datePublished":"2026-11-06T11:18:51.000Z","dateModified":"2026-11-06T11:18:51.000Z","language":"en","abstract":"Intel foundry and packaging division official 李圭午 outlined larger package designs with at least 32 high-bandwidth memory stacks. Intel has not disclosed a production timetable or yield data for the largest projection.","section":"Technology","references":[{"title":"CoWoS capacity remains tight as TSMC expands its advanced-packaging facilities","url":"https://www.tokenpost.com/news/business/43239"}]}