Taiwan PCB Executive Warns of 20% Substrate Materials Gap in 2027

欣興 Chairman 簡山傑 warned that PCB substrate materials could face a 20% supply gap in 2027, adding pressure to Taiwan’s circuit-board supply chain as demand for AI hardware grows.

He raised the concern at the Oct. 20 opening of TPCA Show 2026. Taiwan’s PCB industry-chain output, covering domestic and overseas operations, is estimated at NT$1.1365 trillion for 2026, up 24.2% from 2025. If reached, it would be the industry’s first annual total above NT$1 trillion.

簡山傑 said supply constraints have spread from substrates to equipment and raw materials. He called for substrate capacity expansion to keep pace with the wider supply chain, including stronger local or regional supplies of materials and equipment. He also identified water, electricity and land as requirements for further expansion.

Executives from 臻鼎-KY, 欣興, 台光電, 聯茂 and 燿華 discussed the industry’s outlook at the show. 臻鼎-KY said supplies of its advanced products remain tight and shortages of upstream materials have persisted. It has invested in advance to ensure it can supply customers when their new platforms enter mass production. The company said it has passed most cost increases to customers.

燿華 Chairman 張元銘 called for continued investment in advanced manufacturing and research in Taiwan, with a larger role for the industry in developing future AI hardware. 聯茂 CEO 蔡馨暉 identified AI processors, advanced servers and high-speed networking equipment as sources of demand for electronic materials.

台光電 expects demand for advanced copper-clad laminates to keep growing in 2027. Its chairman, 董定宇, expects strong industry demand to continue through 2030.