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Samsung Electronics, SK hynix Aim for HBM4 Shipments Around Q2 2027

The eight-layer memory is planned for NVIDIA’s Rubin Ultra NVL rack-scale systems; 12-layer HBM4 remains the main focus for 2026.

By John Kim
Published
A silicon memory stack rests beside a patterned wafer / TokenPost.ai (macro)
A silicon memory stack rests beside a patterned wafer / TokenPost.ai (macro)

Samsung Electronics and SK hynix are aiming to start producing and shipping eight-layer HBM4 for NVIDIA around the second quarter of 2027, for Rubin Ultra NVL rack-scale systems.

Twelve-layer HBM4 remains the main focus for 2026. The share of eight-layer units is expected to increase significantly starting in mid-2027, as the companies move toward the planned production and delivery window.

John Kim

John Kim reports on the digital-asset business for TokenPost. Send corrections or tips to info@tokenpost.com.

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