Four Institutions Back $63 Billion Financing for Anthropic’s Broadcom Chips

Bank of America, Blackstone, Citi and Morgan Stanley are backing a $63 billion financing structure for Broadcom AI chips and networking gear that will support Anthropic’s computing capacity.

The four institutions jointly announced the arrangement Tuesday. Financing will run through a newly formed special-purpose vehicle (SPV). The SPV will purchase Broadcom XPU AI accelerators and networking solutions, then lease the equipment to Anthropic. The vehicle will serve as both buyer and lessor, with Anthropic using the systems under the lease.

Bank of America, Citi and Morgan Stanley will arrange the first-lien financing. Blackstone will be the sole investor in the second-lien portion. Broadcom will provide residual-value support to the SPV equal to the amount of the first-lien financing.

The $63 billion structure is intended to support AI computing capacity. It forms part of a strategic compute agreement Broadcom announced earlier. Deliveries are scheduled to begin in 2027.