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Wedbush Flags TSMC CoWoS as a Potential Supply-Chain Pinch Point
The firm said it could not independently verify reports of a possible price increase for the chip-packaging technology.

Wedbush Securities said reports that Taiwan Semiconductor Manufacturing Company Limited (TSMC) could raise prices for its chip-on-wafer-on-substrate (CoWoS) technology may indicate the technology is again a supply-chain pinch point.
The firm said it could not independently verify the possible increase.