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Wedbush Flags TSMC CoWoS as a Potential Supply-Chain Pinch Point

The firm said it could not independently verify reports of a possible price increase for the chip-packaging technology.

A silicon wafer rests above a layered chip packaging substrate / TokenPost.ai
A silicon wafer rests above a layered chip packaging substrate / TokenPost.ai

Wedbush Securities said reports that Taiwan Semiconductor Manufacturing Company Limited (TSMC) could raise prices for its chip-on-wafer-on-substrate (CoWoS) technology may indicate the technology is again a supply-chain pinch point.

The firm said it could not independently verify the possible increase.

John Kim

John Kim reports on the digital-asset business for TokenPost. Send corrections or tips to info@tokenpost.com.

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