Add as a preferred source on GoogleGlobalFoundries Signs $2 Billion TSMC CoWoS Deal for New York Site
The five-year agreement covers silicon interposers, with production expected to begin ramping in Malta during the first half of 2028.
GlobalFoundries announced Oct. 8 a five-year, $2 billion agreement with Taiwan Semiconductor Manufacturing Co. (TSMC) to manufacture silicon interposers for TSMC’s CoWoS packaging technology at GlobalFoundries’ Malta site in New York.
Production is expected to begin ramping at the site in the first half of 2028. The agreement covers the interposer stage, one part of the broader packaging process.
CoWoS combines logic chips and high-bandwidth memory in a single package, providing AI accelerators with data bandwidth for computing workloads.
John Kim
John Kim reports on the digital-asset business for TokenPost. Send corrections or tips to info@tokenpost.com.