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聯發科 Forecasts Q4 Revenue Growth of Up to 32%, Adds ASIC Customer

The company expects revenue to rise 25% to 32% from the third quarter and its new cloud-chip project to begin recognizing revenue in 2028.

A silicon die rests beside the patterned edge of a wafer / TokenPost.ai
A silicon die rests beside the patterned edge of a wafer / TokenPost.ai

聯發科 (2454) expects fourth-quarter revenue to grow as much as 32% sequentially and confirmed a second cloud ASIC customer, adding another project to its data-center chip business.

The company projected revenue of NT$210.1 billion to NT$221.8 billion for the quarter, an increase of 25% to 32% from the third quarter. It tied the outlook to AI PCs, shipments across smart-device categories and flagship chip deliveries. 聯發科 also expects full-year revenue measured in U.S. dollars to exceed its earlier high-single-digit growth target.

The new cloud ASIC project is underway, with revenue recognition expected to begin in 2028.

During analyst Q&A, CEO 蔡力行 said some dies for the second-generation ASIC had completed tape-out. The larger, more complex dies require additional weeks of work but remain on schedule, he said.

聯發科 maintained its $16 billion target for its ASIC business in 2027 and expects strong expansion to continue in 2028.

John Kim

John Kim reports on the digital-asset business for TokenPost. Send corrections or tips to info@tokenpost.com.

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