Samsung Advances HBM Packaging Plant Opening by One Year

Samsung Electronics has moved up the scheduled opening of a new high-bandwidth memory (HBM) packaging plant by one year, bringing planned capacity online sooner for a market driven by AI server demand.

The production line in Asan, South Korea, is now expected to begin operating in June 2028. Samsung plans to make HBM4E and other next-generation memory products at the facility, which is designed to include about 31,000 square meters of cleanroom space.

At the Nov. 12 groundbreaking ceremony in Asan, South Korean President Lee Jae-myung put the planned plant investment at about $4.5 billion. He also cited roughly $29.9 billion in subsequent advanced-equipment investment tied to the project.

Samsung tied the earlier schedule to rapidly increasing storage demand from AI servers, the market the project is meant to serve. The site adds packaging capacity to the company's memory roadmap, and its stated production start is June 2028. That date is the next concrete milestone for the expansion.