Add as a preferred source on GoogleCompal Showcases 800-Volt AI Data Center Power Design at OCP Summit
The system includes megawatt-scale power and cooling capabilities. Compal has not disclosed customers, orders or deployments.
Compal Electronics is showcasing an 800-volt power design for AI data centers at the Open Compute Project Global Summit in San Jose, highlighting infrastructure aimed at rising rack power demands.
The system combines high-density computing, power delivery, cooling and rack integration. Its higher-voltage design is intended to address increasing rack power density and reduce power-conversion complexity.
Compal has not provided performance figures or announced customer deployments, orders or commitments. It has not identified a specific NVIDIA platform for the showcase or confirmed that the system uses Vera Rubin. Pricing and a launch date were also not disclosed.
NVIDIA submitted Vera Rubin rack and compute-tray designs to the Open Compute Project as part of its MGX architecture. Under MGX 1.2, racks can support up to 250 kilowatts, with a liquid-cooled busbar rated at 5,000 amps.
The OCP Global Summit runs Oct. 12-15 at the San Jose McEnery Convention Center. Compal’s booth is E65.
Simon Yoon
ReporterSimon Yoon reports on blockchain technology for TokenPost. Send corrections or tips to info@tokenpost.com.