IBM And Siemens Join Research To Advance Nanostack Transistors

IBM and Siemens are researching ways to advance IBM’s nanostack transistor architecture, combining semiconductor device work with electronic design automation as the companies pursue a manufacturing foundation for the technology.

The research covers design, simulation and lithography techniques. It includes virtual modeling to assess performance, optimize designs and address fabrication challenges.

IBM unveiled its nanostack architecture earlier this year. The companies’ collaboration aims to help establish the manufacturing foundation needed to move the architecture toward production.

IBM plans to make an early nanostack process design kit available in the first quarter of 2027. That timeline applies to the kit; no schedule for the IBM-Siemens research collaboration was provided.