Samsung Engineer Says Open Specs Could Cut Hardware Integration Time

Siamak Tavallaei, a senior principal engineer at Samsung Semiconductor, estimates that clear hardware specifications could cut reintegration across hyperscalers to three to six months from nine to 12 months, potentially shortening deployment work for systems built by different suppliers.

Tavallaei’s estimate concerns hardware designed for one hyperscaler and then integrated at another. It is a projection, not a measured industry-wide reduction.

Industry standards efforts address systems that combine hardware from multiple suppliers. The Open Compute Project’s Composable Memory System effort covers technologies such as Compute Express Link (CXL), which can pool and share memory across systems.

The Open Compute Project’s 2026 Global Summit program included sessions on CXL memory expansion, open specifications and reference designs. Samsung has worked with Advanced Micro Devices to validate CXL memory for scaling capacity and bandwidth, and listed memory-pooling demonstrations at the summit.

Those projects and demonstrations show ongoing work on open memory systems. They do not establish how much time clear specifications will save during hardware integration.