Micron to Present Multigeneration Technology Roadmap at Oct. 21 Webinar

Micron Technology will outline a multigeneration technology roadmap at an Oct. 21 webinar and discuss how next-generation AI infrastructure will need more bandwidth, capacity and efficiency.

Scott DeBoer, Micron’s president and chief technology and products officer, will lead the presentation. He will discuss developments in DRAM, high-bandwidth memory (HBM) and NAND, as well as the company’s plans across multiple generations of technology.

The presentation will also cover Micron’s joint design work with customers and its long-term research. Micron expects future AI infrastructure to need more efficient ways to move, store and access data, in addition to greater bandwidth and capacity.

Cloud servers supporting AI use growing quantities of DRAM, high-bandwidth memory (HBM) and NAND. In 2026, Micron started volume production of its 36GB, 12-high HBM4 product and sampled a 48GB, 16-high version with multiple customers.

DeBoer is scheduled to present the roadmap at the Oct. 21 webinar.