Semiconductor Executives Frame AI Hardware as a System-Level Challenge

Executives at the GSA Women’s Leadership Initiative on Oct. 30 described AI hardware as a system-level challenge, with performance shaped by data movement, packaging and production rather than processors alone. The event was listed for 1 p.m. ET (5 p.m. UTC).\n\nQualcomm Vice President of Product Management and Marketing Letizia Giuliano discussed data movement as a constraint on AI performance. Intel’s Nisha Ananthakrishnan discussed EMIB packaging. The interviews also covered firmware, sourcing, manufacturing and chip-design tools.\n\nASE’s VIPack platform includes fan-out packaging, 2.5D and 3D integrated circuits, and co-packaged optics for AI, high-performance computing and data-center systems.\n\nThe GSA Women’s Leadership Initiative aims to increase women’s leadership in semiconductors, investment in women-led startups and participation in STEM-focused roles.