Samsung Proposes HBM4 Prices Above Three Times HBM3E Levels

Samsung Electronics has proposed a mid-$4 price per gigabit for 2027 high-bandwidth memory (HBM4), more than three times the roughly $1.50 price for current HBM3E, as chipmakers negotiate supply for artificial intelligence systems.

The negotiated price will affect Samsung’s 2027 HBM average selling price and profitability as its product mix shifts toward HBM4. A substantial portion of next year’s HBM capacity has already been negotiated, and Micron has signed agreements for most of its 2027 HBM bit supply.

Micron Chief Executive Sanjay Mehrotra said HBM prices next year would be “far higher than 2026.” Samsung’s final contract prices remain a key variable, while SK Hynix is negotiating its 2027 supply volumes and prices with customers.

Industry estimates put the average HBM selling price in 2027 about 121% above this year. A 12-layer, 36GB HBM4 unit is estimated to rise from about $600 this year to about $1,300 next year. These are estimates rather than disclosed contract prices; actual prices vary by customer, specifications and contract terms.

HBM vertically stacks DRAM dies and consumes more wafer capacity than conventional DRAM, making supply difficult to expand quickly. Samsung’s final HBM4 contract prices, along with qualification and production yields, remain factors to watch.

The developments add to earlier coverage of Micron’s HBM demand and the memory cycle.