TokenPost topic
Advanced packaging
12 TokenPost stories are tagged Advanced packaging. The newest appear first.
Latest Advanced packaging stories
- Lee Attends Samsung Electronics Groundbreaking at Asan Campus
The Nov. 12 event took place at the company’s Onyang campus as South Korea pursues a wider semiconductor expansion.
· Technology
- AMD Completes Panel-Level EFB Validation and Targets 2027 CPU Production
Venice will use TSMC’s N2 process and CoWoS-L packaging, while SP8 is expected in the first half of 2027.
· Business
- Onto Innovation Sets Quarterly Revenue Record at $409.7 Million
Third-quarter revenue rose 88% from a year earlier. The company forecast fourth-quarter revenue of $430 million to $450 million.
· Business
- NVIDIA Adds JNTC to Supplier List as Paid Glass Samples Continue
The South Korean processor remains at the paid-sample stage, with initial production supply planned for mid-2028.
· Business
- Camtek Posts Record $161.3 Million Quarter, Expects 2027 Revenue Above $800 Million
Operating income reached $47.5 million, and advanced packaging made up about 80% of quarterly revenue.
· Business
- Taiwan Suppliers Prepare Plants and Chip IP for TSMC’s 2-Nanometer Ramp
TSMC expects 2027 N2-family capacity to exceed its 2026 level by more than 100% as suppliers advance construction, equipment and chip-design projects.
· Business
- Taiwan Wafer Makers Move Toward First Price Increases in Three Years
Some orders planned for early 2027 began shipping about a quarter ahead of schedule. 徐秀蘭 expects double-digit growth for the global silicon wafer industry over the next two years.
· Business
- TSMC Expands AP7, AP8 as CoWoS Capacity Remains Tight
Two factories beside TSMC’s Fab 15 are linked to a potential purchase for more than NT$20 billion. The transaction remains unconfirmed.
· Business
- Applied Materials Plans to Raise Besi Stake to About 20%
The share purchase is subject to a U.S. antitrust waiting period as the companies expand their advanced-packaging work for AI chips.
· Business
- SK hynix Seeks Suppliers to Prepare iHBM Cooling for 2029 HBM5
The design places an integrated cooling element near base-die GPU links and can reduce thermal resistance by more than 30%.
· Technology
- Amkor Plans More Than 300% Increase in Advanced Packaging Capacity by 2028
The company aims to reach the target by the end of 2028.
· Business
- Applied Materials Adds Kioxia to EPIC Center for AI Memory Work
The companies will develop memory structures, chip-stacking methods, advanced packaging and materials engineering for higher storage density and performance.
· Business